Volume 1, Issue 4, December 2018, Page: 85-89
A Kind of Frequency Subspace Identification Method with Time Delay and Its Application in Temperature Modeling of Ceramic Shuttle Kiln
Zhu Yonghong, School of Mechanical and Electronic Engineering, Jingdezhen Ceramic Institute, Jingdezhen City, China
Yu Yuanjun, School of Mechanical and Electronic Engineering, Jingdezhen Ceramic Institute, Jingdezhen City, China
Wang Jianhong, School of Electronic Engineering and Automation, Jiangxi University of Science and Technology, Ganzhou City, China
Received: Nov. 9, 2018;       Accepted: Dec. 20, 2018;       Published: Jan. 22, 2019
DOI: 10.11648/j.ajcst.20180104.12      View  989      Downloads  124
In this paper, a problem in engineering area which the output variables are not corresponding to input variables is presented. To improve it, a kind of method to the identification and modeling of a common linear state system with delay factor are studied. The domain of this system with time-delay factor is transformed from the time-domain to the frequency-domain firstly, and then the subspace identification model with the hiding delay factor is constructed by using the data of frequency domain response. The coefficient matrix of the constructed model is identified by using the principal component analysis. And the engineering system can be modeled by knowing the state matrices in time domain which can be extracted from the coefficient matrices and using the least squares method from the frequency domain. On this basis, the time-delay factor of original system is split from input matrix by a kind of separated method. At last, the method proposed is used to identify the temperature system model of ceramic shuttle kiln. Simulation results show that the proposed method is effective and feasible.
Subspace Identification, Time-Delay System, Principal Component Analysis
To cite this article
Zhu Yonghong, Yu Yuanjun, Wang Jianhong, A Kind of Frequency Subspace Identification Method with Time Delay and Its Application in Temperature Modeling of Ceramic Shuttle Kiln, American Journal of Computer Science and Technology. Vol. 1, No. 4, 2018, pp. 85-89. doi: 10.11648/j.ajcst.20180104.12
Copyright © 2018 Authors retain the copyright of this article.
This article is an open access article distributed under the Creative Commons Attribution License (http://creativecommons.org/licenses/by/4.0/) which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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